The potting of electronic components involves filling the assembly with a compound such as liquid resin (e.g., epoxy, silicone, polyurethane) to protect it from environmental or use conditions like moisture, humidity, and vibration. Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component.

When running a business, many scenarios cross your mind. You prepare and plan and adapt. Yet very few, if any, can say they were prepared for the global pandemic that has put stress on not only their company, but also its team members and its operations. As always in challenging times, good things still have the opportunity to happen.

Master Bond EP17HTS-DA is a one-component, no-mix, die-attach epoxy that is electrically conductive and withstands high temperatures.

The new DOWSIL CC-8030 UV and moisture dual-cure conformal coating from Dow is reportedly the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual-cure system for high throughputs.

The automated application of sealants and adhesives in settings such as automotive production requires that predictable, reproducible quantities are applied, and that they flow properly and remain in place during the final setting period.

While many filling technologies exist, gravimetric or net weight fillers remain a predominant fill method in the CASE industry. These fillers utilize a scale to measure the precise amount of product dispensed to a container.

Premixed and frozen (PMF) refers to plural-component resin systems delivered in syringes and cartridges that are premixed and frozen in dry ice.