CREATIVE MATERIALS: Semiconductor Die-Attach Adhesive

Creative Materials recently introduced 122-47—a polyimide, single-component, silver filled, electrically conductive semiconductor die-attach adhesive. Designed for die-attachment and surface-mount applications, the product can be applied by stamping, screen printing, dipping, and syringe dispensing. Other applications include assembling electrical and electronic components. The cure schedule allows for rapid processing and exhibits excellent thermal stability and adhesion at high temperatures up to 325ºC (617ºF).

Extractable ionic content is under 5 ppm of chlorine, sodium, and potassium. The volume resistivity is 0.00015 ohm-cm and thermal conductivity of >2.4 W/m-k.

Learn more at www.creativematerials.com.