Innovation-based startup company Lumina Adhesives has developed a new technology platform of switchable pressure-sensitive adhesives called Adhelight^TM that enables debonding on demand.

BASF is the first to have eco-efficiency analysis methodology validated by independent, third-party NSF International.

Research has shown that allergy may play a role in the pathogenesis of autism.

Researchers at the University of Chicago and Lawrence Berkeley National Laboratory have developed an “electronic glue” that could accelerate advances in semiconductor-based technologies, including solar cells and thermoelectric devices that convert sunlight and waste heat, respectively, into useful electrical energy.

May National Associates has developed a new line of adhesives and sealants, due in part to funding and networking contacts from the soybean checkoff.

Georgia-Pacific Chemicals has announced the launch of its LEAF^TM low-emission adhesives.

Almost four in 10 (39%) Americans are preferentially buying products they believe to be “environmentally friendly.”

The Ukiah Daily Journal reports that Performance Coatings has settled a dispute with the Environmental Protection Agency over an alleged failure to provide a complete record of chemicals used by the company in 2004, 2005 and 2006.

NYSERDA has announced funding opportunities for ultraviolet (UV) and electron beam (EB) curing technologies used in the manufacturing industries.

International consumer goods manufacturer Henkel, Düsseldorf, Germany, has once again been included as a leader in the FMCG market segment of the Dow Jones Sustainability World Index.