PUR-FECT LOK® 34-9023 is a 100-percent-solids, moisture-curing hot melt adhesive designed to provide high green strength, fast setting speed and good deflection resistance.

This company now offers Dyne pens and Dyne testing solutions for measuring the surface tension of plastics and other polymer substrates.

This company’s latest Technology Report contains information related to mixing, blending, drying and dispersion.

Bostik HM7229 is a dimer polyamide-based hot melt adhesive.

This company has released Insulbond 865, a fast-setting, 1:1-mix epoxy adhesive system that meets UL 94-V-0 burn-test requirements.

Mereco Metrethane™ 4721 is a new, two-component, low-viscosity polyurethane elastomer.

Four new technical bulletins highlight the rheology, adhesion, thickening and film properties of the company’s Airflex® 920 Dev emulsion.

This company has developed BOSS® 319 formulated to exhibit faster cure times and increased adhesion to a variety of materials.

This company offers a new family of pallet-labeling systems that offers superior bar-code reliability, more versatility in label placement and full PC interface with host mainframe computers.

This company introduces a wireless glue system for roll-fed labeling.