2024 ASI Top 20: LINTEC Corp.

LINTEC's BSF film and a semiconductor wafer. Image courtesy of LINTEC Corp.

Established in 1934, LINTEC is a manufacturer of adhesive-related products, including adhesive papers and films for seals and labels, automobile-use products, window films, semiconductor-related tapes and equipment, LCD-related products, color papers for envelopes and release papers and films. With a presence in approximately 19 countries and regions, the company employs approximately approximately 5,400 people.

Total net sales for LINTEC fell by 2.9% in its fiscal year that ended March 31, 2024. The company has three Japan-based consolidated subsidiaries, as well as approximately 39 additional consolidated subsidiaries around the world.

In the Printing and Industrial Materials Products business segment, 2023 fiscal year sales increased by 30.0%. This group produces products such as adhesives for automotive applications, adhesive tapes for industrial applications, adhesive papers and films for labels, and films for numerous additional applications, as well as many other products. The U.S.-based Mactac subsidiary is part of this segment.*

Sales in the Electronic and Optical Products segment decreased by 14.6% overall. Products produced by this segment include tapes for semiconductor applications, multilayer ceramic capacitor-related tapes, and adhesives for touchscreen applications, among others.

(*Editor’s note: Since Mactac, LINTEC’s U.S. subsidiary, provided adhesives/sealants-related details and requested that they be withheld, specific sales levels for LINTEC will likewise not be published to avoid any potential conclusions being drawn. Mactac’s sales were subtracted when determining LINTEC’s ranking.)

NOTES: In October 2023, LINTEC announced it had developed two new labelstock products that peel off cleanly during the washing process after plastic container collection and can be efficiently recovered.

At the end of April of this year, the company announced the development of a new bump support film (BSF) that improves the durability and reliability of semiconductor chips, using resin to protect the ball bump interconnection between the die and substrate. The new product, a tape integrated with back grinding tape, became available on May 1, 2024.

Opening image courtesy of LINTEC Corp.