This company has introduced Loctite(r) 3593, a rapid-cure, capillary-flow liquid epoxy underfill encapsulant for use in chip-scale package applications that require high reliability and resistance to mechanical shock. The product is ideal for applications where process speed is of critical concern, such as production of memory cards, chip carriers, hybrid circuits, multi-chip modules and other advanced packages. This unfilled underfill product cures rapidly on exposure to heat, with full cure in just 5 minutes at 150 deg C. Circle No. 114