This company’s PROFORM™ line of structural hot melt adhesives is ideal for high-speed manufacturing applications, and is capable of attaching difficult-to-bond substrates such as polypropylene and polyethylene. These solvent-free adhesives are formulated to fill large gaps, curing rapidly as they cool, with no post-reaction cure required. These adhesives offer high tensile and impact strength, low-temperature flexibility, temperature creep resistance, chemical and moisture resistance, and low flammability.