National Starch and Chemical announced that its COOL-LOK® low-temperature, hot melt adhesive has been registered in Class 1 by the United States Patent and Trademark Office.

National Starch and Chemical Co., Bridgewater, N.J., announced that its COOL-LOK® low-temperature, hot melt adhesive has been registered in Class 1 by the United States Patent and Trademark Office. The adhesive is used in the manufacture of corrugated cases and paperboard cartons.