Ohmex AG is a silver-filled conductive epoxy thermoset designed for establishing ohmic bonding in semiconductor devices such as transistors, diodes, rectifiers, thermistors, and integrated monolithic and hybrid circuits. This low-outgassing, one-part adhesive is supplied as a thin paste. It is available in a modified form with an internal lubricant, which allows for use in devices where sliding or rubbing is encountered. Circle No. 151