The electronics group of Henkel ahs announced the launch of three new UV-cure encapsulants for use in Smart Card IC module manufacturing. The dam-and-fill products are to be marketed under Henkel's Hysol brand and are named Hysol 3323, Hysol 3327, and Hysol 3329. Developed using the latest single-component epoxy technology, these encapsulants provide faster curing times, improved adhesion, minimized tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal-cure encapsulants.