Dr. Dave tackles two questions this month, one related to package stability for moisture-sensitive urethane adhesives, and the other regarding epoxy adhesives.
Question: My colleague and I are working on a unique challenge of trying to find a solution for manufacturing urethane-based adhesives that are quite sensitive to moisture exposure.
With electrical and thermal conductivity properties, the epoxy bonds well to a variety of substrates, including metals, glass, ceramics, rubbers, and many plastics.
May 4, 2021
Master Bond EP77M-FMed is a two-part epoxy adhesive and sealant designed for use in the assembly of medical devices.
Safe and produced from an annually renewable feedstock, isosorbide has a combination of properties that offers excellent potential for a range of CASE applications.
Better resistance to UV, abrasion, scratching, and impact. Better adhesion and improved properties for water-based formulation. The demands on today’s coatings, adhesives, sealants, and elastomers (CASE) create a long list of desirable properties for feedstocks.
Local production facilities will allow Sika to comply with Qatar's state sourcing policy that stipulates preference be given to domestically manufactured products.
April 16, 2021
Sika recently announced that it has started manufacturing epoxy resins and has expanded its production capacity for concrete admixtures in Qatar.
Strong demand from the aviation industry is propelling market growth of epoxy resins, which are widely used as corrosion inhibitors.
April 14, 2021
The global epoxy resins market was estimated to be valued at more than $3.5 billion in terms of revenue in 2019 and is predicted to grow at a CAGR of 6.6% from 2020 to 2027, according to a report published by Coherent Market Insights.
As part of a collaborative project focusing on coatings and joining systems for lightweight materials, the U.S. Army Combat Capabilities Development Command (DEVCOM) Army Research Laboratory (ARL) tasked PPG to develop a high-strength, highly ductile structural adhesive to meet the requirements of the U.S. Department of Defense’s (DoD) test method standard MIL-PRF-32662, Tier I-III specification. MIL-PRF-32662 incorporates a decade of rigorous research efforts to statistically correlate the complex ballistic response of adhesively bonded armor assemblies to universally translatable and commercially relevant quasi-static mechanical properties.
Recent innovations in the electronics industry, such as hybrid vehicles, mobile electronic devices, medical applications, digital cameras, computers, defense telecommunications, and augmented reality headsets, touch nearly every part of our lives.