Articles Tagged with ''sealants in assembly''

A new IGF research project is being conducted with the SKZ Plastics Center and the Fraunhofer Institute for Manufacturing Technology and Advanced Materials researching several non-destructive testing methods to advance the quality assurance of sealing compounds.

A recent collaboration between an automated dispensing systems provider and a UV/LED curing specialist created an inline, five-step process for CIPG dispensing and curing.

The SILASTIC SA 994X LSR series is a range of primerless, self-adhesive, general purpose, and self-lubricating, one-to-one mix ratio liquid silicone rubbers (LSRs) designed for two-component injection molding with thermoplastic substrates including, but not limited to, polybutylene terephthalate and polyamide.

Lightweighting of structures is most often associated with automotive structures. However, lightweighting is a challenge across the transportation sector, including trucks, trailers, buses, passenger rail cars, and even heavy earth-moving equipment and cranes.

The 10th annual ASSEMBLY Show is set to take place October 25-27, 2022, at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Original equipment manufacturers (OEMs) may find that post-curing can bring value to certain applications. To determine if post-cure is the best option, it’s important to better understand what is happening during the process, the advantages it offers, and key best practices.

According to Cotronics, its Durabond™ 7032 stainless steel aluminum putty has the ability to bond, repair, and seal high-temperature equipment up to 2,000˚F. 

Room-temperature vulcanizing (RTV) silicones are well-known for their extreme durability. They are convenient one-component sealants that cure by reaction with moisture from the atmosphere.

IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.

A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.