Articles Tagged with ''adhesives in electrical/electronic''

EpoxySet recently announced that it supplies EC-1012M/EH-20 flame-resistant potting compound for protecting power supplies, high-voltage batteries, coil windings, transformers, PC boards, and other electronic devices.

According to a recent IPC survey, electronics manufacturers continue to feel the impact of COVID-19 on their businesses.

Electric vehicles (EVs) have been rapidly adopted in recent years, and the rate of market growth has shown to be significantly higher than that of the fuel-injected automotive market. Indeed, the global stock of electric cars surpassed five million in 2018.

Premixed and frozen (PMF) refers to plural-component resin systems delivered in syringes and cartridges that are premixed and frozen in dry ice.

Every four years, the adhesives and sealants community gathers at the World Adhesive and Sealant Conference (WAC) to explore opportunities for education, networking, and growth. This year’s event, hosted by the Adhesive and Sealant Council (ASC) and co-organized by the Asia Regional Adhesive Council (ARAC) and FEICA (association of the European Adhesive and Sealant Industry), will be held April 20-22 at the Chicago Hilton in Chicago, Ill.

Creative Materials, Inc. recently introduced GPC 251A/B2612, a two-component 100% solids, silver-filled conductive epoxy adhesive.

Phoseon Technology recently announced the launch of its FireJet FJ801 area curing solution, targeting adhesives cure applications in electronics manufacturing and lab material/substrate curing.

This first installment of a two-part series highlights the value proposition of today's adhesive chemistries and curing methods to high-value end-use markets.