Articles Tagged with ''adhesives in electrical/electronic''

Shin-Etsu Silicones LiDAR materials

Shin-Etsu Silicones to Showcase Thermal Management Sensor Application Products at Automotive LiDAR Conference

SESA’s focus for LiDAR and automotive sensors will reportedly be its silicone thermal interface materials (TIMs); visible light-blocking encapsulants; UV-curable, low-modulus adhesives; and anti-smudge coatings.
September 20, 2019

In an effort to advance silicones for automotive light detection and ranging (LiDAR) applications, Shin-Etsu Silicones of America, Inc. (SESA) will exhibit at the second annual Automotive LiDAR 2019 Conference and Exhibition.


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Henkel EV battery pack materials

Henkel to Debut Electric Vehicle Battery Material Solutions at the Electric & Hybrid Vehicle Technology Expo

Henkel materials specialists have reportedly developed novel formulations that allow for large-scale production at high speed, reduce the risk of thermal event-related safety concerns, and enable various battery architectures.
September 6, 2019

At the 2019 Electric & Hybrid Vehicle Technology Expo, which will be held September 10-12 in Novi, Mich., Henkel reports that it will display its latest material technologies for cost-effective high-volume assembly, protection, and thermal control of next-generation electric vehicle (EV) battery systems.


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acquisitions_mergers_gears

Meridian Adhesives Group Acquires Epoxies, Etc.

Based in Cranston, R.I., Epoxies, Etc. offers products that are used in the electronic, electrical, construction, and decorative industries.
August 27, 2019
Meridian Adhesives Group recently announced its acquisition of Epoxies, Etc., a resin formulator of epoxies, urethanes, and silicones.
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Zymet SMTA International conference

Zymet and Portland State to Present on Reworkable Adhesives for Wafer-Level Packages at SMTA International Conference

The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
August 23, 2019
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
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Electronics_Generic

Nordson MARCH Presents Paper on Plasma Applications for Wafer-Level Packaging at ICEPT

Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
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Master Bond Supreme electronics adhesives

MASTER BOND INC.: Non-Premixed and Frozen, One-Part Epoxy for Chip Coating

Supreme 3CCM-85 reportedly cures within 2-3 hrs at 175-185°F (80-85°C), which is advantageous for use on heat-sensitive components and substrates.
August 7, 2019
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is reportedly a new single-component epoxy initially designed for glob top and chip coating applications.
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