Articles Tagged with ''adhesives in electrical/electronic''

Supreme 3HTND-2DM is a rapid-curing, toughened, one-part epoxy system used for the dam-and-fill method for chip-on-board encapsulation.

Steven Abramovich has been named head of sales, Americas, for its electronics business.

LOCTITE HF 2W is a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.

This company recently introduced active alignment (AA) adhesives designed for camera module assembly.

This company now offers Dymax SpeedMask 9-7001.

A new reworkable edgebond adhesive* from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP).  The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, Ill.

The global electronic adhesives market is expected to grow at a compound annual growth rate (CAGR) of close to 10% from 2017-2021, according “Global Electronic Adhesives Market 2017-2021,” a recent report from Technavio.

IPC APEX EXPO 2017 will be held from February 14-16 at the San Diego Convention Center.

Two new adhesives with low halogen content are available from this company.