Novel formulation for grounding applications provides room-temperature moisture cure capability to protect heat-sensitive substrates while improving yield and enhancing reliability
January 23, 2023
Designed to deliver robust electrical grounding performance, this moisture-cure ECA helps to safeguard the thin, miniaturized substrates within mobile device camera components.
Henkel has launched a new dual-cure adhesive specifically designed for bonding applications in automotive ADAS cameras and LiDAR modules. Using a unique UV cationic thermal dual-cure epoxy, Loctite Ablestik NCA 3218 offers a solution for applications such as lens barrel-to-housing and lens housing-to-circuit board bonding.
The live event – to be held February 22-23, 2023 – is aimed at users and specialists from the electrical and electronic engineering sector, both from production and development. Registration is open until February 10, 2023.
Henkel recently announced the acquisition of the Thermal Management Materials business of Nanoramic Laboratories, headquartered in Boston, Massachusetts.