Henkel Electronic Materials has developed an electrically conductive adhesive (ECA) that overcomes the drawbacks of older generation ECAs and extends the material’s advantages to multiple applications.
Liquid optically clear adhesives (LOCA) from this company can reportedly help improve the viewing experience, increase display durability, extend product life, reduce power consumption, and enable thinner device designs.
Xenon Corp. recently announced the formation of the Printed Electronics Test Center Network, a consortium of manufacturers, integrators and universities.
This company's electronics bonding solutions can help manufacturers achieve higher Electronic Product Environmental Assessment Tool (EPEAT) criteria ratings by earning optional points for enabling greater rework and more effective recycling.
This company’s low-pressure molding MACROMELT technology portfolio has been expanded to include a material designed specifically for high thermal stability and chemical resistance.
IPC–Association Connecting Electronics Industries® recently announced the appointment of John W. Mitchell to the position of president and CEO, effective April 23
