Bostik, a manufacturer of industrial, construction, and consumer adhesives, exhibits its extensive line of adhesives and sealants for battery applications at this year’s Battery Show North America at the Suburban Collection Showplace in Novi, Michigan, September 13-15, 2022.

American Securities LLC and Arsenal Capital Partners announced that an affiliate of American Securities has acquired Meridian Adhesives Group, in partnership with the management team and funds affiliated with Arsenal.

IPC announced the July 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program.

The electronics manufacturing industry is applauding the U.S. Senate for taking bipartisan action on legislation that will, if enacted, spur a new era of innovation, manufacturing, and investment within the electronics industry.

Contaminated printed circuit board assemblies can lead to poor performance. Oils and flux residue can prevent proper adhesion of conformal coatings, while marking inks, adhesives, and other materials can cause PCB delamination, blistering, shorting, dendrite growth, and electrochemical migration. It is therefore critical to remove all leftover manufacturing contaminants and to do it in an environmentally sustainable way. 

Organizers of IPC APEX EXPO 2022 report that the event provided the education and networking connections that helped 3,647 visitors address today’s business challenges and prepare for their factories of the future.

Room-temperature vulcanizing (RTV) silicones are well-known for their extreme durability. They are convenient one-component sealants that cure by reaction with moisture from the atmosphere.

IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.

IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.

A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.