Smurfit-Stone Container Corp. has reported a net loss available to common stockholders of $66 million, or $.26 per diluted share, for the first quarter of 2004.

The National Electronics Manufacturing Initiative will sponsor a tin whisker workshop and a component supplier/large user meeting at the upcoming IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas (June 1-4).

The Composite Can and Tube Institute (CCTI) has announced its 71st Annual Meeting June 5-7 at the Silverado Resort & Country Club in Napa, CA.

Cookson Electronics has named Peter A. Palmer senior vice president of Marketing and New Business Development.

The Lubrizol Corporation has announced the signing of a definitive agreement to purchase Noveon International, Inc. in a transaction valued at $1.84 billion.

Henkel Technologies has promoted Bhavesh H. Muni to a new position as global business manager, Semiconductor Packaging.

Powers Fasteners, Inc., the leading domestic manufacturer of mechanical, adhesive, and powder-actuated fastening systems, has enhanced its sales coverage along the East Coast with the addition of a new branch warehouse location in the Washington, DC area.

During Semicon West in San Jose, Henkel Corp. and STS:IEMT will present "Future Trends in Semiconductor Packaging," a four-hour seminar that will bring together industry leaders to discuss current semiconductor packaging challenges and future industry requirements.

3M has announced the appointment of William (Bill) Myers to the position of president of Dyneon LLC, a wholly owned subsidiary of 3M.

ConProTec Inc. has announced the opening of its MIXPAC Dispenser Repair Division located in Salem, NH.