The National Institute of Standards and Technology (NIST) recently announced it is soliciting proposals to support long-term research in next-generation semiconductor technology, which is critical to the future of the U.S. electronics industry.

OMNOVA Solutions Inc. recently announced income from continuing operations of $10.7 million for the first quarter ended February 29, 2012.

Brookfield recently announced two hands-on courses that equip users of its instruments with the knowledge to get the most out of their viscosity test methods.

The Dow Chemical Co. recently announced plans to invest in a new manufacturing facility for its Dow Coating Materials (DCM) business unit in the Kingdom of Saudi Arabia.

The Adhesive and Sealant Council Inc. (ASC) recently announced five new members in the first three months of 2012, increasing its membership level to 119 member companies.

Brookfield Engineering Laboratories recently announced the appointment of Vincent Hebert to the position of product manager, Powder Flow Tester (PFT).

Ellsworth Adhesives recently announced it has been named a Dow Corning Gold Level Distributor for top performance in 2011.

Despite global economic uncertainty and a downturn in the worldwide composite materials industry, China’s composites market grew by more than 2% through the worst of the recession in 2009.

IDI Composites International recently announced that Chris McClure will head the business development team for its new line of structural thermoset compounds.

H.B. Fuller Co. recently announced it has signed a memorandum of understanding to enter into cross-distribution agreements with Plexbond Quimica S/A in Brazil for flexible packaging products in several countries.