After the perennial top concern over cost reduction, safety is rated as the number one challenge among automotive engineers to stay competitive in the design of the next generation of motor vehicles, according to the 10th annual DuPont sponsored survey of those planning to attend the 2004 SAE World Congress and Exposition, March 8-11.
DEK has announced that its Eform stencil manufacturing process has taken electroform stencils to the next level by incorporating an exclusive, sophisticated aperture height control method to their production of Eform stencils.
Fusion UV Systems, Inc. has announced plans to conduct live UV inkjet printing demonstrations during the upcoming e|5 2004 RadTech North America Technology Expo & Conference being held May 2-5 at the Charlotte Convention Center in Charlotte, NC.
The CHEMARK Consulting Group has announced its involvement in assisting Chemcraft Holdings, Inc. with its recent acquisition of the Alternative Materials Technology Company from AMT Environmental Products, Inc., of Chico, CA
The National Electronics Manufacturing Initiative (NEMI), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, will kick off its 2004 roadmap March 24-25
For nearly 50 years, UCLA Extension's Technical Management Program has helped managers supplement their technical expertise with the specialized skills required to lead, manage and empower others
The Packaging Machinery Manufacturers Institute (PMMI) has issued a call for presentations for the Conference at PACK EXPO to be held in conjunction with PACK EXPO International scheduled for Nov. 7-11, 2004, at McCormick Place, Chicago