TAH Industries, the largest U.S. manufacturer of two-component cartridge systems for the adhesive and sealants industry, has awarded Adhesive Packaging Specialties its PREFERRED FILLER status for the TAH Universal Cartridge System.

Mark your calendar now to attend the inaugural International Wafer-Level Packaging Congress (IWLPC) and Tabletop Exhibition, sponsored jointly by the SMTA and Chip Scale Review magazine.

In July 2004, EMS-GRILTECH placed into operation a new pilot plant for staple fibers and yarns at their Domat/Ems Switzerland location.

Brookfield Engineering Laboratories recently opened a new sales and support office in the Chicago area, which will primarily serve Illinois, Indiana, Wisconsin, and neighboring states.

Attendees who register for the CPP Expo 2005 will also be able to attend PACK EXPO Las Vegas 2005 without incurring additional expense, Leo Nadolske, president, CPP Expo 2005, has announced.

CPFilms, Inc. has announced plans to install new state-of-the-art metallizing production equipment at its manufacturing facility in Martinsville, VA.

In a further expansion of its sales capabilities, Nylok Corp. has appointed Connie Ortega to the new position of Inside Sales Representative at Nylok Western in Anaheim, CA.

Sponsored by the Alliance for the Polyurethanes Industry (API), Polyurethanes Conference will be held October 18-20 at the Paris Las Vegas Hotel and Casino and will feature 15 technical (and two issue-oriented) sessions.

DuraSeal, TruSeal Technologies' next generation, warm-edge flexible spacer system, has passed the requirements outlined by European testing standards EN1279-2, 3 and 6 according to the final report by Dutch test institute TNO-TPD.

Eastman Chemical Co. Chairman and CEO Brian Ferguson and senior executives said the company has made significant progress toward improving profitability and is focusing on a growth strategy that builds on Eastman's strengths in polyester, acetyl, and organic chemistry technologies.