Rohm and Haas Co. has announced several new appointments within its global adhesives and sealants business.

Universal Instruments has announced the establishment of Dover Software India (DSI) in Bangalore, India.

Henkel Adhesives, Nordson Corp. and Aztek Specialty Products have announced a partnership to support low-pressure injection molding worldwide.

The United States Patent Office granted a patent to National Starch and Chemical for its application method for aqueous polymer dispersion to a substrate.

The Bonding Fundamentals Course, Aug. 25-29, in Cary, NC, is being offered by INDA and NCRC Prerequisite for attendance is a BS degree in engineering or textiles.

The Packaging Education Forum (PEF) has accepted the nominations of six career packaging professionals for induction into the Packaging Hall of Fame, Class of 2003.

Research Development & Design focuses on the entire product lifecycle including research, development and product design.

Stanley Silverman, president and CEO of the PQ Corp., has announced the appointment of Amy Ard as treasurer of the corporation.

The Alliance for the Polyurethanes Industry (API) will present recent technical advances with urethane sealants and two-component polyurethane adhesives during the adhesives and sealants technical session at Polyurethanes Expo 2003.

Adhesives Research Inc. announced the recipients of its annual Sales Leadership Awards at the Company's "Training for Growth" sales meeting in June.