Dow has been named to the JUST 100 list for the third year, earning the top spot in the Chemicals sector overall.

Today’s manufacturers have unrestrained access when it comes to bonding solutions. Pressure-sensitive tapes and labels have grown as a viable option, but why are these solutions important?

Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.

FEICA, the Association of the European Adhesive & Sealant Industry, and the Hellenic Association of Chemical Industries (HACI) are collaborating to provide support for a nascent organization.

Huntsman Corp. recently announced several changes to its board of directors, including the appointment of Curtis E. Espeland and José Muñoz to the board.

Sika recently reported that it performed well in a challenging environment in 2021.

Huber Engineered Materials’ acquisition of RHI Magnesita’s 50% ownership stake in the 50/50 joint venture, MAGNIFIN Magnesiaprodukte GmbH & Co. KG, has closed, effective December 31, 2021.

IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.

Creative Materials recently introduced 122-47—a polyimide, single-component, silver filled, electrically conductive semiconductor die-attach adhesive.

The global solid acrylic resins market is estimated to expand at a CAGR of 7.3% in terms of revenue from 2021-2031, according to a report from Transparency Market Research.