The new TEGO^® Cure 100 hardener from Evonik reportedly ensures that coatings cure at room temperature.

Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required.

Dow recently announced the availability of its new solvent-free SYL-OFF™ SL 184 coating, an energy-efficient alternative that minimizes misting at high product label production line speeds.

Henkel has introduced three new low-pressure molding (LPM) materials designed to seal and protect medical devices from moisture, temperature extremes, chemicals, vibration, impact, and other environmental concerns.

ViscoTec recently introduced cartridge applicators featuring Festo pneumatic control modules for the exact and clean feeding of adhesives, pastes, and silicones of different viscosities. 

A self-adhesive, reusable, and compressible sleeve, tesa^® Twinlock can reportedly help packaging printers achieve greater operational efficiency and improve return on investment while reducing the solid waste associated with packaging printing.

Huntsman has launched its ARALDITE^® 2080 adhesive, a low-odor, non-flammable (according to CLP, flashpoint > 60°C), and primer-free structural acrylate adhesive.

Multi-shaft mixers with solids/liquid injection manifold (SLIM) technology from Charles Ross & Son Co. reportedly enable fast and efficient large-scale powder dispersion into low-viscosity liquids.

FEICA, the Association of the European Adhesive and Sealant Industry, recently released a market study focusing on “The European Adhesives and Sealants Market.”

Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.