Henkel Loctite Corp. has introduced new Multicore LF320, a lead-free solder paste optimized for reflow in air on a wide range of PCB assembly applications.

The PRISM line, from Thermo Electron Corp., is for lab engineers who create and test multiple compounds that require a variety of compounding machine configurations.

DL Technology now offers an enhanced encoder count on their Micro ValveT, increasing precision and repeatability for micro volume-dispense applications.

Tra-Bond 223F01 offers a thermal conductivity of 1.34 W/M/K.

National Adhesive offers the hot melt product, COOL-LOK 34-207B adhesive, which sets in 2 to 3 seconds and bonds well to difficult board stocks, including recycled and high performance liners.

Cincinnati Automation Ltd. introduces its automated inspection machines, designed for precision measuring and gauging parts.

Parker's Fluid Control Division offers watertight coils for its Skinner 7000 Series and Gold Ring valves.

Microfluidics has introduced a proprietary steam-sterilizable high-pressure diaphragm needle valve that operates at pressures up to 40,000 psi.

GE Sealants & Adhesives Inc.'s Caulk-It provides consumers with a one-of-kind squeeze tube applicator created for easy, precise, and clean application.

The Tesa Tape Inc. EasySplice product technology is a result of meticulous research and development, as well as close cooperation with leading coated paper manufacturers and global equipment suppliers.