This company has introduced the PD1 Head Driver to enhance the performance of electric heads in hot melt applicator systems.

This company introduces the NatPack-X™ cubic-yard-size intermediate bulk container (IBC), which is uniquely authorized for all three UN packaging groups.

This company’s new Hightemp 221FG is a single-component, room-temperature-stable, smooth epoxy potting compound that can withstand continued high-temperature use.

This company’s CE 3100 electrically conductive adhesive is a lead-free alternative to solder for surface-mount device (SMD) interconnect formation.

This company’s new packaging adhesives feature a family of 3M™ Jet-melt™ Adhesives and 3M™ Gummy Glue Removable Adhesive.

This company introduces Hydroment Plus, the first ceramic-tile grout to meet ANSI A118.6 H-4 and A118.7 specifications for polymer-modified grout.

National Starch and Chemical introduces DUR-O-SET E-150 adhesive copolymer.

The Multi-Scale base kit consists of a Rex A scale durometer, and a choice of one or more color-coded barrel adapters for B, C, D, DO, O or OO scales.

This company has introduced a second autosampler option for its LA-Series of particle-size analyzers.

A new hot melt, pressure sensitive adhesive (PSA) has been formulated to provide better conversion and economy.