The peak intensity of the FireJet™ FJ100 LED curing solution has been increased by 50%, up to 12W/cm2.

Two new substrate wetting additives are now available: TEGO® wet 285 and 550, which were specifically developed for printing on food packaging.

This company, a division of Huntsman Corp., will launch a new portfolio of low-temperature curing agents for heavy-duty industrial coatings applications at the European Coatings Show.

Eight new dispensing brush tips are available, designed to offer end users more diversity.

A-J215 is an elastomeric adhesive that was formulated to help bond and seal FRP, stainless steel, and aluminum applications.

LOCTITE HF 2W is a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.

A newly developed potting adhesive, Structalit® 8801T, is now available.

VESTAKEEP PEEK powders are suitable for applications that are subject to extreme mechanical, thermal, and chemical requirements.

This company recently introduced active alignment (AA) adhesives designed for camera module assembly.

PX901C is a new epoxy resin that offers heat resistance and dimensional stability.