Tapes and functional films, label materials, and RFID materials can be used in EV battery packs to mitigate thermal runaway, provide insulation, and facilitate efficient assembly.
Henkel recently announced the launch of an Application Engineering Center in Chennai, Tamil Nadu, India, further strengthening its Adhesive Technologies business in the electronics sector.
EP53TC from Master Bond is a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial.
The IPC APEX EXPO 2025 is celebrating 25 years of innovation, collaboration, and community at the Anaheim Convention Center in Anaheim, California, March 18-20.
EC-1015HP epoxy potting compound from epoxySet Inc. is a heat-cure system designed for temperature cycling from -55 to 180 °C with significantly better crack resistance than traditional rigid epoxies.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.