To tackle the need for sustainable materials and the changing electronics industry, solventless silicone PSAs present a promising alternative to traditional solvent-based silicone PSAs.

A recent collaboration between an automated dispensing systems provider and a UV/LED curing specialist created an inline, five-step process for CIPG dispensing and curing.

Experts from the adhesive manufacturer as well as industry experts will discuss new developments in sustainable back-end packaging. 

AGC Inc. announced the opening of its AGC Chemicals Technical Center in Hsinchu, Taiwan, in October 2024.

Because of their unique properties in the electronics sector, adhesives and sealants make a difference in terms of process efficiency, design optimization, durability, repairability, and recycling.

From flush exterior door handles to keyless functions, customized polybutadiene potting compounds can play a big part in innovative functionalities and the brand-specific design of a vehicle access systems.

Henkel has further expanded its portfolio of dedicated potting adhesives with three new products to protect vital components including ECU connectors, sensors, and e-motors. 

Dow’s new MobilityScience Studio in Correggio, Italy, will support and advance electric vehicle growth.

Appli-Tec’s 5340 is a two-part epoxy that delivers high lap-shear strength and good thermal conductivity.

WEVO-CHEMIE GmbH has developed specially optimized potting compounds and gap fillers which, in addition to targeted heat removal, also ensure the mechanical stability of the component concerned.