The engineering website has published five new selection guides with technical information about electronic component adhesives, electrically conductive adhesives, thermal adhesives, conformal coatings, and pottants and encapsulants.
DELO is working to enlarge its U.S. customer base, and new additions to its space in Sudbury, Massachusetts, show the services the company has to offer to U.S. manufacturers.
Bodo Möller Chemie and Henkel Adhesive Technologies are partnering in Switzerland to improve technology used to conduct heat away from electronic components.
The demand for compact electronics products has increased, leading to the need for adhesive materials that can provide strong and reliable bonding in miniature applications.
Both companies, sharing a goal to offer sustainable products, partnered to develop, commercialize, and distribute sustainably recycled rubber materials for use in all rubber applications.
New dispensing technologies offer the electronics industry maximum productivity, flexibility, and functionality.
January 7, 2022
The electronics market is booming, and its trends toward component miniaturization, increasingly short cycles, and highest dispensing quality require constant innovation. Dispensing systems are key technologies in an environment of increasing automation and demand for high product output.
Master Bond reports that the epoxy adheres to a variety of substrates, including metals, composites, glass, ceramics, semiconductor materials, and many plastics.
September 21, 2021
Master Bond EP3HTS-TC is a one-part, NASA-low-outgassing-rated epoxy with a thermal conductivity of 16-17 W/(m·K).