COOL-PAD™ CPR7154 is a new class of thermal interface material that reportedly dispenses like a thermal pad but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C. The material is optimized to accommodate large areas with different heights and gaps of less than 3 mil along its interfacing area. It is filled with a modified oxide mixture and is electrically insulating at normal voltage.

The material is semi-tacky on both sides for optimum thermal transfer performance. CPR7154 has high thermal conductivity and low T_gcharacteristics that can impose minimum thermal stress on bonded parts during thermal cycling or shock testing. While it has some intrinsic tack strength, the material is not designed for bonding. A mechanical fastener must be used to provide assembly integrity.

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