A new thermally conductive silicone adhesive is available for electronics applications. SEMICOSIL^® 975 TC is characterized by high thermal conductivity, as well as good flow and processing properties. Light pressure is reportedly enough to form an ultra-thin adhesive layer between the contact surfaces. This can ensure not only good bonding, but also optimum heat dissipation by the heat sink. The adhesive can be used as an interface material for forming thermal and mechanical connections in power electronics components or packages.

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