This company offers a new glob top adhesive with enhanced flow properties. Elomonopox GE4825 can reportedly coat chips in MEMS sensors and other semiconductors in a uniform thickness of less than100 µm, while not extending beyond the chip’s edges.

With the increase in miniaturization in microelectronics packaging, this new adhesive can be used by semiconductor companies who need die coating materials to be as flat as possible and still protect the chip. The heat-curing acrylate offers high flexibility (shore hardness range from A60 to A80) and can reduce the risk of stress in the chip and wires. It also reportedly provides low base viscosity and special flow properties that allow for efficient jet dispensing on a range of chip sizes. This black-colored adhesive not only can protect and preserve the chip’s surface, it also covers its logic structures and makes it possible to cover the chip’s corners where the layer can be extremely thin.

For more information, visit https://www.delo-adhesives.com.