PANACOL: Thermally Conductive Adhesive for Heat-Sensitive Components
Elecolit 6607 reportedly cures at temperatures as low as 80°C, enabling even heat-sensitive components to be bonded together.

Elecolit® 6607 from Panacol is a one-component epoxy resin-based adhesive filled with aluminum oxide. Due to its flow characteristics, the adhesive can reportedly be applied by dispenser, screen printing, or spatula.
Panacol reports that Elecolit 6607 cures at temperatures as low as 80°C, enabling even heat-sensitive components to be bonded together. Curing at higher temperatures will shorten the curing time.
After curing, the light gray adhesive reportedly insulates electrically and provides excellent heat dissipation. Due to its properties, Elecolit 6607 is particularly suitable for bonding metal components and heat sinks to electronic circuit boards.
Additional details are available at www.panacol.com.
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