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Adhesives and Sealants TopicsAdhesive & Sealant ProductsFinished Adhesives and Sealants

HENKEL: Liquid Gap Filler

According to Henkel, its new liquid TIM effectively marries high thermal conductivity of 7.0 W/mK with a maximum possible speed tested of 18 g per second.

Henkel gap filler
A silicone-based, two-part liquid gap filling TIM, Bergquist gap filler TGF 7000 reportedly dispenses quickly and cures in place at room temperature. (Photo courtesy of Bdtronic.)
August 27, 2020

Henkel recently announced the debut of Bergquist gap filler TGF 7000, a thermal interface material (TIM). According to the company, the liquid TIM effectively marries high thermal conductivity of 7.0 W/mK with a maximum possible speed tested of 18 g per second. With excellent throughput capability, the material is well-suited for applications such as automotive ADAS systems, power conversion systems, electric pumps, and ECUs where mass production, reliability, and high thermal conductivity are required for today’s smaller footprint, higher power designs.

“From a chemistry perspective, engineering a liquid TIM with substantive filler content that also allows fast dispensing is an exceptionally difficult balance to achieve,” said Holger Schuh, Henkel global technology expert. “One might expect a liquid material with high thermal conductivity to experience separation, settling, caking and clogging of the dispensing equipment, but Bergquist Gap Filler TGF 7000 exhibits none of these issues.”

A silicone-based, two-part liquid gap filling TIM, Bergquist gap filler TGF 7000 reportedly dispenses quickly and cures in place at room temperature. The material is soft upon cure to minimize stress and has controlled volatility with siloxane content below 300 ppm to provide compatibility with various bonding surfaces and optical components. In addition, manufacturers benefit from risk-free logistics, as storage stability and easy handling are also key attributes.

Working with dispense partners throughout the product’s formulation, significant testing was conducted to validate dispensability. “High-performance liquid gap fillers set high requirements on the dispensing technology: to ensure a precise application without rising the working pressure or to engineer a durable resin circuit that can cope with high-abrasive fillers,” said Florian Schütz, regional sales manager, DACH, with Bdtronic. “With our eccentric screw pumps and static mixing system Duplex+, we are able to set up a high-volume dispensing process with excellent cmk-results and cycle times. Unlike common expectations for higher thermally conductive materials, the material has shown outstanding characteristics in dispensing without stressing the equipment during our early dispensing tests.”

For more information, visit www.henkel.com.

KEYWORDS: adhesives in assembly adhesives in automotive adhesives in electrical/electronic silicones

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