The global epoxy adhesives market is expected to reach $11.6 billion by 2026. These adhesives offer high shear strength while bonding efficiently to substrates like wood, glass, and metal. They also provide minimal shrinkage, superior thermal and chemical resistance, and cohesive strength.

Market studies indicate that the use of structural adhesives will continue to show significant growth in the coming years. Whether for first joining operations, maintenance, or repair operations, the use of paste adhesives offers many advantages compared to welding or traditional mechanical fastening, including ease of use, environmental resistance, sealing, stress distribution, and joining dissimilar materials.

Conagen recently announced the development of debondable hot-melt adhesives made with high-performance materials from sustainable and natural biomolecules. 

According to Cotronics, its Durabond™ 7032 stainless steel aluminum putty has the ability to bond, repair, and seal high-temperature equipment up to 2,000˚F. 

Medical device design engineers hold in their hands the power to help transform people’s health. They have the ever-important job of designing medical devices that help people monitor, track, and adjust their health for the better. However, some design engineers may be making a mistake that can affect how an entire medical device functions: they could be reducing adhesive selection to an afterthought. This critical decision is too often left until device design is almost complete.

After more than 20 years of sharing his expertise and wisdom in the monthly Ask Dr. Dave column, Dave Dunn has retired as a columnist. Here we share some of his most popular columns over the years.

Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required.

Huntsman has launched its ARALDITE^® 2080 adhesive, a low-odor, non-flammable (according to CLP, flashpoint > 60°C), and primer-free structural acrylate adhesive.