Nordson Corp. recently announced that it will demonstrate its latest solutions for semiconductor packaging and electronics manufacturing at SEMICON Taiwan in Taipei.

The design of packaging and dispensing systems can go a long way in supporting adhesive manufacturers and end users in the pursuit of increased efficiencies. Particularly with the optimal filling and application of 2-component adhesives, it’s fundamental to obtain reliable bonds.

The ability to efficiently and accurately dispense adhesives, sealants, and other materials is absolutely vital in assembly operations. Companies that rely on manual methods run into issues with operator error, slow speeds, excessive waste, and other problems.

The methods for dispensing adhesives, epoxies, grease, silicone, oils, sealants, and a multitude of other assembly fluids cover a wide spectrum of techniques—from manual applications like squeeze bottles, toothpicks, and hand-plunger syringes to semi-automated tabletop dispensing robots. Each dispensing method presents unique challenges as manufacturers attempt to scale the sophistication of their fluid dispensing processes to meet requirements for quality, volume throughput, and cost efficiency.