Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
SEMICON West will reportedly take aim at global electronics manufacturing industry disruptors with programs and pavilions focused on critical areas of industry growth.
June 28, 2019
The 49th SEMICON West will be held July 9-11, 2019, at the Moscone Center in San Francisco.
Total North American printed circuit board shipments in March 2019 were up 19.1% compared to the same month last year.
May 3, 2019
IPC-Association Connecting Electronics Industries® recently announced the March 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.
Formulated to conform to highly intricate metal and plastic components, Fermapor K31 is a product line of two-component, crosslinking polyurethane formed-in-place foam sealants.
A new surface treatment can make a variety of electronic surfaces waterproof.
October 6, 2017
International Data Corp. (IDC) discovered more than 900,00 smartphones are damaged by liquids every day globally.1 IDC’s research has found that liquid damage is the second-largest cause of damaged smartphones after broken screens, representing 35% of all devices repaired. This damage results in significant costs to the end users, device manufacturers, carriers and retailers, with the impact of liquid damage estimated to be worth nearly $100 billion each year.
Due to increased interest in smart polymer coatings used to control wetting properties, scientists are working on a way to further develop the properties in applications.