Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
SEMICON West will reportedly take aim at global electronics manufacturing industry disruptors with programs and pavilions focused on critical areas of industry growth.
June 28, 2019
The 49th SEMICON West will be held July 9-11, 2019, at the Moscone Center in San Francisco.
Total North American printed circuit board shipments in March 2019 were up 19.1% compared to the same month last year.
May 3, 2019
IPC-Association Connecting Electronics Industries® recently announced the March 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.
Formulated to conform to highly intricate metal and plastic components, Fermapor K31 is a product line of two-component, crosslinking polyurethane formed-in-place foam sealants.
The tariffs will reportedly increase the cost of technology products for U.S. consumers and businesses without an appreciable impact on the balance of trade between the two countries.
March 26, 2018
IPC recently expressed concern following President Trump’s announcement that he will impose significantly higher tariffs on electronics imported from China.
Electric car makers and tech companies are eagerly looking for cobalt mines with conflict-free mining, and Cobalt Ontario might just be the “silver” ticket.