The Packaging Machinery Manufacturers Institute (PMMI) has issued a call for presentations for the Conference at PACK EXPO to be held in conjunction with PACK EXPO International scheduled for Nov. 7-11, 2004, at McCormick Place, Chicago
To improve its ability to efficiently develop and deliver flexible product and service solutions for customers with widely differing business needs, Dow Corning's Pressure Sensitive Industry team has made several staff changes
Adhesives and Sealants Industry (ASI) magazine and The Adhesive and Sealant Council, Inc. (ASC) have announced plans to present a Chinese business seminar on June 15, at BWI airport in Baltimore, MD, at the Embassy Suites hotel.
BASF has announced that it has strengthened its ability to meet U.S. customers' lead-times and delivery requirements for Lupranate isocyanates and Pluracol polyols by appointing two regional distributors.
ARDE Barinco, Inc., an American manufacturer and distributor of high capability process mixing, grinding, dispersion and emulsification equipment, has announced the recent hiring of Marco Taddeo.
The International Robots & Vision Show and the Assembly Technology Expo (ATExpo) will be held side-by-side September 27-29, 2005, at the Donald E. Stephens Convention Center in Rosemont (Chicago), IL.
The Research & Engineering Council of the National Association for Printing Leadership has announced that its 46th annual Binding, Finishing and Distribution Seminar will be held April 6 and 7, 2004, at the Marriott O'Hare Hotel in Chicago.