Henkel recently announced the acquisition of the Thermal Management Materials business of Nanoramic Laboratories, headquartered in Boston, Massachusetts, marketed under the brand Thermexit™. Nanoramic, until 2018 known as FastCAP Systems Corp., is an R&D company focused on developing high-end energy storage and thermal management technologies based on carbon composites. The Thermexit portfolio includes patented, high-performance thermal interface gap pads based on a nano-filler technology, which provides unique materials with extremely high thermal conductivity and excellent stability.

The acquisition strengthens Henkel’s position in the growing thermal interface material (TIM) market and expands its offerings for applications in growing market segments that require specialized know-how with regards to heat management in electronics, including 5G infrastructure, semiconductors, and power conversion for industrial and automotive electronics.

“Thermal management solutions are an important growth technology within our materials portfolio and play a major role to further drive innovations with regards to global megatrends such as connectivity, mobility and sustainability,” explained Jan-Dirk Auris, executive vice president Henkel Adhesive Technologies.

Learn more at www.henkel.com and www.nanoramic.com.