We have a customer who wants to use an adhesive-backed expanded PTFE gasket strip on a steel substrate. However, the customer wants to be able to remove and reapply the strip without losing adhesion. We do not make ePTFE gasket strips, but we have imported some samples for the customer to test. They are not satisfied with the results. I must admit, I am not surprised. Is there such a thing as a PSA that can be removed and reapplied a number of times without losing adhesion?

This company has released a new foam bonding study that helps customers pair its advanced adhesives with polyurethane foams.

Polyurethanes can be one- or two-component systems. The single-component systems comprise a polyester or polyether polyol that has been end-capped with an isocyanate.

Adding accessories to cars and trucks is a burgeoning and lucrative business for many aftermarket shops. The trend is driven by consumers who are looking to customize and differentiate their vehicles from the standard models on the roadways. While some OEMs are beginning to offer add-on accessories at the dealership, approximately 85% of accessory sales are done through aftermarket accessory shops.

Multi-material designs are becoming increasingly common for industrial assemblies, with the growing incorporation of materials like integrated glass, structural composites, or scratch-resistant surfaces.

Prior to the 1980s, it was common for cars to rust. The lower doors and rocker panels were usually the first to go, followed by the floor pans, wheel wells and bumpers. Even the hood, deck lid and the roof were not immune. Aftermarket companies sprang up to “undercoat” cars to prevent rust. Automakers followed suit and offered undercoating as an option as they sought a solution.

Do reactive acrylics and anaerobics behave like epoxies in terms of curing and properties like heat resistance?

A new mixer has been installed and is operational in the company's Wollaston, UK, plant.

A new reworkable edgebond adhesive* from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP).  The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, Ill.

The global electronic adhesives market is expected to grow at a compound annual growth rate (CAGR) of close to 10% from 2017-2021, according “Global Electronic Adhesives Market 2017-2021,” a recent report from Technavio.