WACKER recently announced that it has opened a global competence center for thermal interface materials (TIMs) in Shanghai, China.

IPC recently announced that it has made the decision to move IPC APEX EXPO 2021 to March due to ongoing concerns with COVID-19.

The pandemic has drastically changed the landscape for businesses across all industries, forcing immediate changes that will often have long-term consequences.

IPC recently announced the July 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program.

IPC and International Electronics Manufacturing Initiative (iNEMI) have signed a memorandum of understanding (MoU) to collaborate and share information.

IPC recently announced the June 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program.

Sumitomo Bakelite Co., Ltd. recently announced its intention to open a new manufacturing line to produce epoxy encapsulation composite materials for automotive applications at its Belgian production subsidiary, Vyncolit NV.

The battery-powered PPG Semco 285-B mixer is intended to mix two-part aerospace sealants, adhesives, and other potting compounds.

To reinforce the importance of quality in process and manufacturing, standardization for supply chain effectiveness, and industry advancement, IPC and the Automotive Industry Action Group (AIAG) recently renewed their cooperative agreement.

Master Bond EP36FR is a specialized one-part epoxy that meets Airbus specifications for toxic gas emissions per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F.